Electroless Plating by Glenn O. Mallory, Juan B. Hajdu

By Glenn O. Mallory, Juan B. Hajdu

This ebook describes the chemical ideas of the most important electroless techniques and the sensible functions of those ideas within the undefined. because of the coordinated efforts of 26 person authors - this publication fills the void which has existed for a whole reference on electroless deposition.

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This precipitate consists of nickel particles, and either nickel phosphide or nickel boride, depending on the reducing agent being used. Fortunately, chemical agents called stabilizers are available to prevent the homogeneous reaction that triggers the subsequent random decomposition of theentire plating bath. To usestabilizerseffectively, thechemist must, first of all, The Fundamental Aspects of Electroless Nickel Plating 35 be able to identify those problems that can be solved by the use of stabilizers.

It should be noted that hydrolysis here occurs in the bulk of the solution and should not be confused with the hydrolyzed nickel species that originates at the catalyst surface. Partial chelation of the nickel ion increases its resistance to hydrolysis, and it is possible to keep the nickel ion in solution at a higher pH than would otherwise be possible. However, as the pH increases, the disassociation of protons from the remaining coordinated water molecules frequently occurs and further hydrolysis of the nickel ion will result.

O or stabilizer). 15M. polarization curves is shown in Fig. 12. The cathodic curves show an inconsistent shift in the location of the curve vs. thiourea concentration. This may be due to the combined or preferential inhibition of the hydrogen evolution reaction, nickel reduction, and/or the phosphorus reduction reaction. Assuming that thiourea inhibits phosphorus reduction, it could account for the decrease in the phosphorus content of deposits obtained from deposits containing thiourea. On theother hand, thefamilyof anodiccurves in Fig.

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